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IXFN55N50 Datasheet(PDF) 1 Page - IXYS Corporation |
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IXFN55N50 Datasheet(HTML) 1 Page - IXYS Corporation |
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1 / 4 page ![]() © 2004 IXYS All rights reserved S G S D miniBLOC, SOT-227 B (IXFN) E153432 TO-264 AA (IXFK) Features • International standard packages • Encapsulating epoxy meets UL 94 V-0, flammability classification • miniBLOC with Aluminium nitride isolation • Low R DS (on) HDMOS TM process • Rugged polysilicon gate cell structure • Unclamped Inductive Switching (UIS) rated • Low package inductance • Fast intrinsic Rectifier Advantages • PLUS247 package for clip or spring bar mounting • Easy to mount • Space savings • High power density G = Gate D = Drain S = Source TAB = Drain Either Source terminal at miniBLOC can be used as Main or Kelvin Source S G D D (TAB) DS97502G(11/04) HiPerFETTM Power MOSFET Single Die MOSFET IXFK 55N50 IXFX 55N50 IXFN 55N50 V DSS = 500 V I D25 =55 A R DS(on) = 90m Ω Ω Ω Ω Ω t rr ≤≤≤≤≤ 250 ns PLUS247(IXFX) G C E (TAB) Symbol Test Conditions Characteristic Values (T J = 25°C, unless otherwise specified) Min. Typ. Max. V DSS V GS = 0 V, ID = 1 mA 500 V V GS(th) V DS = VGS, ID = 8 mA 2.5 4.5 V I GSS V GS = ±20 VDC, VDS = 0 ±200 nA I DSS V DS = VDSS 25 µA V GS = 0 V T J = 125°C2 mA R DS(on) V GS = 10 V, ID = 0.5 ID25 90 m Ω Pulse test, t ≤ 300 µs, duty cycle d ≤ 2 % Symbol Test Conditions Maximum Ratings V DSS T J = 25°C to 150°C 500 V V DGR T J = 25°C to 150°C 500 V V GSS Continuous ±20 V V GSM Transient ±30 V I D25 T C = 25°C55 A I DM T C = 25°C, pulse width limited by TJM 220 A I AR T C = 25°C55 A E AR T C = 25°C60 mJ dv/dt I S ≤ I DM, di/dt ≤ 100 A/µs, VDD ≤ VDSS 10 V/ns T J ≤ 150°C, RG = 4 Ω P D T C = 25°C 625 W T J -55 ... +150 °C T JM 150 °C T stg -55 ... +150 °C T L 1.6 mm (0.062 in.) from case for 10 s (IXFK, IXFX) 300 °C M d Mounting torque (IXFK, IXFX) 1.13/10 Nm/lb.in. Terminal leads (IXFN) 1.13/10 Nm/lb.in. V ISOL 50/60 Hz, RMS (IXFN) t = 1minute 2500 V~ I ISOL ≤ ≤≤≤≤ 1 mA t = 1 s 3000 V~ Weight PLUS247 5 g TO-264 10 g SOT-227B 30 g |
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