8-Ch Tx Active Beamforming IC

13.75 – 17.3 GHz

F6513

Short-Form Datasheet

© 2020 Renesas Electronics Corporation

1

March 13, 2020

Description

The F6513 is an 8-channel transmit active beamforming RFIC

designed for application in Ku-Band planar phased array antennas

for communications or radar applications. The IC has a single

common RF input port and eight output channels. The eight

independently controlled output channels can drive eight single-

polarized elements or four dual-polarized elements of an

electronically scanned array (ESA). Each channel has 6 bits of

digital phase control covering 360° and 25dB of gain control with a

minimum step size of 0.2dB, enabling precise beam pattern and

polarization control.

Operating from a single supply of 2.1 - 2.5V, the RFIC has 23dB of

nominal small signal gain with a typical P1dB of 12.5dBm per

channel. The device is highly efficient and features a low power

standby mode as well as independent enable controls on every

channel. The F6513’s SPI bus and control pins operate from

standard 1.8V logic at speeds up to 50MHz. Advanced digital

modes and large on-chip memory allow for < 100ns beam position

switching times at the array level, greatly reducing dead time and

latency.

Finally, the compact and CTE-matched FC-BGA organic package

with all single-ended 50ohm matched RF ports greatly simplifies

the physical integration of the F6513 onto large antenna panels.

Typical Applications



Phased array antennas



Ku-band SATCOM terminals



Common Data Link (CDL) terminals



Ku-band radar



Aerospace and maritime



Instrumentation

Features



13.75 – 17.3GHz operation



Supports 4 dual-pol elements or 8 single-pol



360° phase control with 6-bit resolution



25dB gain control with 0.2dB minimum step



23dB small signal gain



12.5dBm output P1dB



2.3V nominal single supply input



Standard 1.8V digital logic



Temperature compensation



Temperature sensor with digital readout



Advanced digital modes with fast beam steering



On-chip beam-state memory



3.8 × 4.6 × 0.9 mm, 62-pin FC-BGA package

Block Diagram