FSV1045V

www.onsemi.com

2

Symbol

Parameter

Value

Unit

Peak Repetitive Reverse Voltage

45

V

Working Peak Reverse Voltage

45

V

RMS Reverse Voltage

32

V

DC Blocking Voltage

45

V

Average Rectified Output Current (Note 2)

10

A

Non−Repetitive Peak Forward Surge Current (Note 3)

300

A

Typical Junction Capacitance

820

pF

Operating Junction Temperature Range

−55 to +150

°C

Storage Temperature Range

−55 to +150

°C

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality

should not be assumed, damage may occur and reliability may be affected.

2. Mounted on 30 mm x 30 mm FR4 PCB

3. Pulse condition: 8.3 ms half−sine wave. Test method is compliant with MIL standard (MIL−STD−750E)

Symbol

Parameter

Minimum Land

Pattern

Maximum Land

Pattern

Unit

Junction−to−Ambient Thermal Resistance

100

40

°C/W

Junction−to−Lead Thermal Characteristics, Thermocouple Soldered

to Anode

15

12

°C/W

Junction−to−Lead Thermal Characteristics, Thermocouple Soldered

to Cathode

6

5

Figure 1 and Figure 2. PCB size: 76.2 x 114.3 mm. Minimum land pattern size: 4.9 x 4.8 mm (big pattern, x1), 1.4 x 1.52 mm (small pattern,

x2). Maximum land pattern size: 30 x 30 mm (pattern, x2). Force line trace size = 55 mils, sense line trace size = 4 mils.

Figure 1. Minimum Land Pattern of 2 oz Copper

Figure 2. Maximum Land Pattern of 2 oz Copper

F

S

F

S

F

S

F

S

F

S