www.recom-power.com

REV.: 0/2021

I-7

DC/DC Converter

Specifications

RPL-3.0

Series

SOLDERING

0

0

100

300

200

100

200

155°C

185°C

217°C

217°C

300

Time [s]

Ramp Down Rate: -1~ -5°C/s

Ramp Up Rate: 1-3°C/s

Preheat Temp.: 60-120°C

Peak Temp.: 240-245°C

Peak Time: 10s max.

Ramp up Rate: 1-3°C/s

Melting Time: 30-60s

PREHEAT ZONE

COOLING

ACTUAL

HEATING

Solder Pofil

Wave or Reflow etc.

Profile Feature

PB-Free

Assembly

Preheat

minimum Temperature (TS_min)

155°C

maximum Temperature (TS_max)

245°C

Time (tS)

100s-300s

Liquidus

Temperature (TL)

217°C

Time (tL)

30-60s

Peak Temperature (TP)

245°C

Time remaining around Peak Temperature

10s

max Ramp Down Rate (from Ts_max to TP)

5°C/s

max Ramp Up Rate

3°C/s

max time from 25°C to Peak Temperature (TP)

8min

1 Pb-Free assembly is recommended according ro JEDEC J-STD020.

2 Ensure that the peak reflow temperature does not exceed 240°C ±5°C as

per JEDEC J-STD020

3 The reflow time period during peak temperature of 240°C ±5°C should not

exceed 30 seconds.

4 Reflow time above liquidus (217°C) should not exceed 150 seconds.

5 For solder paste use a standard SAC Alloy such as SAC 305, type 3 or higher.

6 Other soldering methods (e.g. vaporphase) are not verified and have to be

validated at his own risk.

PCB LAYOUT SUGGESTION

Efficient PCB layout is critical for stable operation. For the best results, see Figure below and follow the guidelines below:

2. Ensure that all feedback connections are short and direct.

3. Place the feedback resistors as close to the chip as possible.

4. Route sensitive analog areas such as FB away from SW.

5. Place enough vias around the chip to improve thermal performance.

Top Layer

Bottom Layer