SC−88/SC70−6/SOT−363

CASE 419B−02

ISSUE Y

DATE 11 DEC 2012

SCALE 2:1

NOTES:

1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD FLASH,

PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRU-

SIONS, OR GATE BURRS SHALL NOT EXCEED 0.20 PER END.

4. DIMENSIONS D AND E1 AT THE OUTERMOST EXTREMES OF

THE PLASTIC BODY AND DATUM H.

5. DATUMS A AND B ARE DETERMINED AT DATUM H.

6. DIMENSIONS b AND c APPLY TO THE FLAT SECTION OF THE

LEAD BETWEEN 0.08 AND 0.15 FROM THE TIP.

7. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION.

ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 TOTAL IN

EXCESS OF DIMENSION b AT MAXIMUM MATERIAL CONDI-

TION. THE DAMBAR CANNOT BE LOCATED ON THE LOWER

RADIUS OF THE FOOT.

C

12

3

A1

A

c

65

4

E

b

6X

XXXMG

G

XXX = Specific Device Code

M

= Date Code*

G

= Pb−Free Package

GENERIC

MARKING DIAGRAM*

1

6

STYLES ON PAGE 2

1

DIM MIN

NOM

MAX

MILLIMETERS

A

−−−

−−−

1.10

A1

0.00

−−−

0.10

ddd

b

0.15

0.20

0.25

C

0.08

0.15

0.22

D

1.80

2.00

2.20

−−−

−−− 0.043

0.000

−−− 0.004

0.006 0.008 0.010

0.003 0.006 0.009

0.070 0.078 0.086

MIN

NOM

MAX

INCHES

0.10

0.004

*This information is generic. Please refer to

device data sheet for actual part marking.

Pb−Free indicator, “G” or microdot “ G”,

may or may not be present.

E1

1.15

1.25

1.35

e

0.65 BSC

L

0.26

0.36

0.46

2.00

2.10

2.20

0.045 0.049 0.053

0.026 BSC

0.010 0.014 0.018

0.078 0.082 0.086

(Note: Microdot may be in either location)

*Date Code orientation and/or position may

vary depending upon manufacturing location.

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

0.65

0.66

6X

DIMENSIONS: MILLIMETERS

0.30

PITCH

2.50

6X

RECOMMENDED

TOP VIEW

SIDE VIEW

END VIEW

bbb H

B

SEATING

PLANE

DETAIL A

E

A2

0.70

0.90

1.00 0.027 0.035 0.039

L2

0.15 BSC

0.006 BSC

aaa

0.15

0.006

bbb

0.30

0.012

ccc

0.10

0.004

A-B D

aaa C

2X 3 TIPS

D

E1

D

e

A

2X

aaa H D

2X

D

L

PLANE

DETAIL A

H

GAGE

L2

C

ccc C

A2

6X

MECHANICAL CASE OUTLINE

PACKAGE DIMENSIONS

ON Semiconductor and

are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.

ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding

the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically

disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the

rights of others.

98ASB42985B

DOCUMENT NUMBER:

DESCRIPTION:

Electronic versions are uncontrolled except when accessed directly from the Document Repository.

Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.

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