P0640C2 datasheet(3/4 Pages) LEIDITECH

Part #	P0640C2

Description	Excellent xapability of absorbing transient surge

PDF	4 Pages

Scroll/Zoom	100%

Manufacturer	LEIDITECH [Shanghai Leiditech Electronic Technology Co., Ltd]

Direct Link	http://www.leiditech.com

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3 / 4 page

Solder Reflow Recommendations

●

Recommended reflow methods: IR,

vapor phase oven, hot air oven, wave

solder.

●

The device can be exposed to

temperature of 265°C for 10 seconds.

●

Devices can be cleaned using standard

industry methods and solvents.

Notes: If reflow temperatures

exceed the

recommended profile,

devices may not meet the

performance requirements.

Thermal Considerations

Product Dimensions

Dime-

nsion

Inches

Millimeters

MIN

MAX

MIN

MAX

0.130

0.155

3.30

3.94

0.201

0.22

5.10

5.60

0.077

0.083

1.95

2.11

0.166

0.185

4.22

4.70

0.030

0.063

0.75

1.60

0.075

0.096

1.90

2.45

0.002

0.008

0.05

0.20

0.077

0.096

1.95

2.45

0.018

0.028

0.46

0.71

0.008

0.014

0.20

0.35

0.022

0.028

0.56

0.71

0.039

0.053

1.00

1.35

0.052

0.058

1.32

1.47

Package

SMB-3

Symbol

Parameter

Value

Unit

Operating Junction

Temperature

-40 to +150

℃

Storage Temperature

Range

-40 to +150

℃

RθJA

Junction to Ambient on

printed circuit

℃

P0640C2

Rev :

www.leiditech.com

01.06.2018

3/4

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