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P4200SC Datasheet(PDF) 4 Page - Shanghai Leiditech Electronic Technology Co., Ltd |
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P4200SC Datasheet(HTML) 4 Page - Shanghai Leiditech Electronic Technology Co., Ltd |
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4 / 5 page  Solder Reflow Recommendations ● Recommended reflow methods: IR, vapor phase oven, hot air oven, wave solder. ● The device can be exposed to a maximum temperature of 265°C for 10 seconds. ● Devices can be cleaned using standard industry methods and solvents. Notes: If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements Thermal Considerations Package DO-214AC/SMA Symbol Parameter Value Unit TJ Operating Junction Temperature -40 to +150 ℃ TS Storage Temperature Range -40 to +150 ℃ RθJA Junction to Ambient on printed circuit 90 ℃ /W P4200SC Rev : www.leiditech.com 01.06.2018 4/5 |
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