T4-LDS-0302-1, Rev. 1 (6/13/13)

©2013 Microsemi Corporation

Page 2 of 6

1N6675UR-1 – 1N6677UR-1 plus

CDLL0.5A20 – CDLL0.5A40

MECHANICAL and PACKAGING

•

CASE: Hermetically sealed glass case package.

•

TERMINALS: Tin/lead plated or RoHS compliant matte-tin (commercial grade only) over copper clad steel. Solderable per MIL-

STD-750, method 2026.

•

POLARITY: Cathode end is banded.

•

MOUNTING: The axial coefficient of expansion (COE) of this device is approximately +6PPM/°C. The COE of the mounting

surface system should be selected to provide a suitable match with this device.

•

MARKING: Part number.

•

TAPE & REEL option: Standard per EIA-296. Consult factory for quantities.

•

WEIGHT: Approximately 0.04 grams.

•

See Package Dimensions on last page.

PART NOMENCLATURE

1N6675UR-1 – 1N6677UR-1:

1N6675

UR

-1

(e3)

JEDEC type number

(see Electrical Characteristics

table)

MELF Surface Mount

RoHS Compliance

e3 = RoHS compliant

Blank = non-RoHS compliant

Metallurgically Bonded

1N6677UR-1 only:

JAN 1N6677

UR -1

(e3)

Reliability Level*

JAN = JAN level

JANTX = JANTX level

JANTXV = JANTXV level

JANS = JANS level

JEDEC type number

(see Electrical Characteristics

table)

RoHS Compliance

e3 = RoHS compliant (on

commercial grade only)

Blank = non-RoHS compliant

Metallurgically Bonded

MELF Surface Mount

CDLL0.5A20 – CDLL0.5A40:

CDLL

0.2A

20

(e3)

Microsemi Designation

Amp Rating

Working Peak Reverse

RoHS Compliance

e3 = RoHS compliant

Blank = non-RoHS compliant