Surface Mount Fast Recovery Rectifiers

Features

Low profile space

Ideal for automated placement

Glass passivated chip junctions

Low forward voltage drop

Low leakage current

High forward surge capability

High temperature soldering 260

/10 seconds at terminals

Mechanical Date

Case: SOD-323 molded plastic body over glass passivated chip

Terminals: Solder plated, solderable per JESD22-B102

Polarity: Laser band denotes cathode end

y

Maximum Ratings & Thermal Characteristics

Note 1: Mounted on P.C.B. with 0.036 x 0.06” (0.9 x 1.5mm) copper pad areas.

Note 2: Pulse test:300μs pulse width,1% duty cycle.

μA

50

nS

Reverse recovery time

150

250

500

Maximum reverse current

5

UNIT

Instantaneous forward

voltage

(2)

1.3

V

Items

Test conditions

Symbol

/ W

Operating junction and storage temperature

range

–55 to +125

Maximum average forward rectified current

0.5

A

Peak forward surge current 8.3 ms single half

sine-wave superimposed on rated load

10

A

Maximum DC blocking voltage

Maximum RMS voltage

V

Maximum repetitive peak reverse voltage

BA158WS

UNIT

Items

Symbol

BA157WS

(1)

35

Thermal resistance from junction to lead

Weight: 0.0063gram

400

600

1000

V

280

420

700

V

400

600

1000

BA159WS

BA158WS

BA157WS

BA159WS

BA157WS

THRU

BA159WS

SOD-323

Marking:

3FG

BA157WS-------3FG

BA158WS-------3FJ

BA159WS-------3FM

Typical Current Squared Time

I T

2

0.415

A S

2

2020-11/08

REV:A