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FSB50650BS Datasheet(PDF) 2 Page - ON Semiconductor

Part # FSB50650BS
Description  Motion SPM 5 Series
PDF  11 Pages
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Manufacturer  ONSEMI [ON Semiconductor]
Direct Link  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

FSB50650BS Datasheet(HTML) 2 Page - ON Semiconductor

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FSB50650B / FSB50650BS
www.onsemi.com
2
PACKAGE MARKING AND ORDERING INFORMATION
Device
Device Marking
Package
Packing Type
Reel Size
Quantity
FSB50650B
FSB50650B
SPM5P−023
Rail
NA
15
FSB50650BS
FSB50650BS
SPM5Q−023
Tape & Reel
330 mm
450
ABSOLUTE MAXIMUM RATINGS (TC = 25°C, Unless otherwise noted)
Symbol
Parameter
Conditions
Rating
Unit
INVERTER PART (Each MOSFET Unless Otherwise Specified)
VDSS
Drain−Source Voltage of Each MOSFET
500
V
*ID 25
Each MOSFET Drain Current, Continuous
TC = 25°C
4.0
A
*ID 80
Each MOSFET Drain Current, Continuous
TC = 80°C
2.5
A
*IDP
Each MOSFET Drain Current, Peak
TC = 25°C, PW < 100 ms
10.3
A
*IDRMS
Each MOSFET Drain Current, Rms
TC = 80°C, FPWM < 20 kHz
1.8
Arms
CONTROL PART (Each HVIC Unless Otherwise Specified)
VDD
Control Supply Voltage
Applied Between VDD and COM
20
V
VBS
High−side Bias Voltage
Applied Between VB and VS
20
V
VIN
Input Signal Voltage
Applied Between IN and COM
−0.3 ~ VDD+0.3
V
BOOTSTRAP DIODE PART (Each Bootstrap Diode Unless Otherwise Specified.)
VRRMB
Maximum Repetitive Reverse Voltage
500
V
* IFB
Forward Current
TC = 25°C
0.5
A
* IFPB
Forward Current (Peak)
TC = 25°C, Under 1 ms Pulse Width
2.0
A
THERMAL RESISTANCE
Rth(j−c)Q
Junction to Case Thermal Resistance
(Note 1)
Inverter MOSFET part, (Per Module)
2.1
°C/W
TOTAL SYSTEM
TJ
Operating Junction Temperature
−40 ~ 150
°C
TSTG
Storage Temperature
−40 ~ 125
°C
VISO
Isolation Voltage
60 Hz, Sinusoidal, 1 minute,
Connection Pins to Heatsink
1500
Vrms
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. For the Measurement Point of Case Temperature TC, Please refer to Figure 4.
2. Marking “ * ” Is Calculation Value or Design Factor.
3. Using continuously under heavy loads or excessive assembly conditions (e.g. the application of high temperature/ current/ voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions
(i.e. operating temperature/ current/ voltage, etc.) are within the absolute maximum ratings and the operating ranges.



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