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T56D107M025CSS025 Datasheet(PDF) 16 Page - Vishay Siliconix |
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T56D107M025CSS025 Datasheet(HTML) 16 Page - Vishay Siliconix |
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16 / 17 page ![]() Polymer Guide www.vishay.com Vishay Revision: 13-Apr-2021 10 Document Number: 40076 For technical questions, contact: polytech@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 GUIDE TO APPLICATION 1. AC Ripple Current: the maximum allowable ripple current shall be determined from the formula: where, P = power dissipation in W at +45 °C as given in the tables in the product datasheets. RESR = the capacitor equivalent series resistance at the specified frequency. 2. AC Ripple Voltage: the maximum allowable ripple voltage shall be determined from the formula: or, from the formula: where, P = power dissipation in W at +45 °C as given in the tables in the product datasheets. RESR = The capacitor equivalent series resistance at the specified frequency. Z = The capacitor impedance at the specified frequency. 2.1 The tantalum capacitors must be used in such a condition that the sum of the working voltage and ripple voltage peak values does not exceed the rated voltage as shown in figure below. 3. Temperature Derating: power dissipation is affected by the heat sinking capability of the mounting surface. If these capacitors are to be operated at temperatures above +45 °C, the permissible ripple current (or voltage) shall be calculated using the derating coefficient as shown in the table below: 4. Reverse Voltage: the capacitors are not intended for use with reverse voltage applied. However, they are capable of withstanding momentary reverse voltage peaks, which must not exceed the following values: At 25 °C: 10 % of the rated voltage or 1 V, whichever is smaller. At 85 °C: 5 % of the rated voltage or 0.5 V, whichever is smaller. At 105 °C: 3 % of the rated voltage or 0.3 V, whichever is smaller. 5. Mounting Precautions: 5.1 Soldering: capacitors can be attached by conventional soldering techniques; vapor phase, convection reflow, infrared reflow, wave soldering, and hot plate methods. The soldering profile charts show recommended time / temperature conditions for soldering. Preheating is recommended. The recommended maximum ramp rate is 2 °C per s. Attachment with a soldering iron is not recommended due to the difficulty of controlling temperature and time at temperature. The soldering iron must never come in contact with the capacitor. For details see www.vishay.com/doc?40214. 5.2 Limit Pressure on Capacitor Installation with Mounter: pressure must not exceed 4.9 N with a tool end diameter of 1.5 mm when applied to the capacitors using an absorber, centering tweezers, or similar (maximum permitted pressurization time: 5 s). An excessively low absorber setting position would result in not only the application of undue force to the capacitors but capacitor and other component scattering, circuit board wiring breakage, and / or cracking as well, particularly when the capacitors are mounted together with other chips having a height of 1 mm or less. 5.3 Flux Selection 5.3.1 Select a flux that contains a minimum of chlorine and amine. 5.3.2 After flux use, the chlorine and amine in the flux remain must be removed. 5.4 Cleaning After Mounting: the following solvents are usable when cleaning the capacitors after mounting. Never use a highly active solvent. • Halogen organic solvent (HCFC225, etc.) • Alcoholic solvent (IPA, ethanol, etc.) • Petroleum solvent, alkali saponifying agent, water, etc. Circuit board cleaning must be conducted at a temperature of not higher than 50 °C and for an immersion time of not longer than 30 minutes. When an ultrasonic cleaning method is used, cleaning must be conducted at a frequency of 48 kHz or lower, at an vibrator output of 0.02 W/cm3, at a temperature of not higher than 40 °C, and for a time of 5 minutes or shorter. Notes • Care must be exercised in cleaning process so that the mounted capacitor will not come into contact with any cleaned object or the like or will not get rubbed by a stiff brush or similar. If such precautions are not taken particularly when the ultrasonic cleaning method is employed, terminal breakage may occur • When performing ultrasonic cleaning under conditions other than stated above, conduct adequate advance checkout MAXIMUM RIPPLE CURRENT TEMPERATURE DERATING FACTOR ≤ 45 °C 1.0 55 °C 0.8 85 °C 0.6 105 °C 0.4 125 °C 0.25 I RM S P R ESR ------------ = V RM S Z P R ESR ------------ = V RMS I RM S x Z = Rated voltage Ripple voltage Operating voltage Working voltage Time (s) |
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