TS4962M datasheet(31/32 Pages) STMICROELECTRONICS

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TS4962M

Package Mechanical Data

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Package Mechanical Data

9-bump flip-chip

Figure 67. Pin-out for 9-bump flip-chip (top view)

Figure 68. Marking for 9-bump flip-chip (top view)

Figure 69. Mechanical data for 9-bump flip-chip

1/A1

7/C1

8/C2

9/C3

4/B1

6/B3

2/A2

3/A3

5/B2

GND

STBY

GND

OUT

1/A1

7/C1

8/C2

9/C3

4/B1

6/B3

2/A2

3/A3

5/B2

GND

STBY

GND

OUT

■ Bumps are underneath

■ Bump diameter = 300

µm

■ ST Logo

■ Symbol for lead-free: E

■ Two first XX product code: 62

■ third X: Assembly code

■ Three digits date code: Y for year - WW for week

■ The dot is for marking pin A1

XXX

YWW

XXX

YWW

■

Die size: 1.6mm x 1.6mm

±30µm

■

Die height (including bumps): 600

µm

■

Bump diameter: 315

µm ±50µm

■

Bump diameter before reflow: 300

µm ±10µm

■

Bump height: 250

µm ±40µm

■

Die height: 350

µm ±20µm

■

Pitch: 500

µm ±50µm

■

Coplanarity: 50

µm max

1.60 mm

0.5mm

∅ 0.25mm

1.60 mm

0.5mm

∅ 0.25mm

600µm

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