HMC8193LC4TR-R5 datasheet(4/36 Pages) AD

4 / 36 page

HMC8193

Data Sheet

Rev. B | Page 4 of 36

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

Rating

RF Input Power

21 dBm

LO Input Power

25 dBm

IF Input Power

21 dBm

IF Source/Sink Current

6 mA

Continuous Power Dissipation, PDISS

(TA = 85°C, Derate 12.44 mW/°C Above 85°C)

1120 mW

Maximum Junction Temperature

175°C

Maximum Peak Reflow Temperature (MSL3)

260°C

Operating Temperature Range

−40°C to +85°C

Storage Temperature Range

−65°C to +150°C

Electrostatic Discharge (ESD) Sensitivity

Human Body Model (HBM)

2000 V

Field Induced Charged Device Model (FICDM)

1250 V

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to

PCB thermal design is required.

Table 3. Thermal Resistance

Package Type

θJA

θJC

Unit

E-24-11

120

°C/W

Thermal impedance simulated values are based on a JEDEC 2S2P test board

with 4 × 4 thermal vias. See JEDEC JESD51-12 for additional information.

ESD CAUTION

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