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PD69208M Datasheet(PDF) 22 Page - Microchip Technology |
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PD69208M Datasheet(HTML) 22 Page - Microchip Technology |
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22 / 35 page ![]() 5.2 Thermal Specifications The following tables list the thermal specifications the PD69208T4, PD69204T4, and PD69208M. Table 5-2. Thermal Specifications Thermal Resistance Typ Units Notes θJA 19.0 °C/W Junction-to-ambient thermal resistance. ΨJT 0.05 °C/W Junction-to-top thermal characterization parameter. A thermal metric derived from the difference in junction temperature (TJ) and package top temperature (TT) divided by total heating power (PH). θJC(top) 4.9 °C/W Junction-to-case thermal resistance with heat flow through package top. θJB 15.2 °C/W Junction-to-board thermal resistance. Note: All parameters are as per JEDEC JESD-51. PD69208T4/PD69204T4/PD69208M Package Information © 2020 Microchip Technology Inc. Datasheet DS00003428C-page 22 |
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