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HT82V805 Datasheet(PDF) 9 Page - Holtek Semiconductor Inc |
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HT82V805 Datasheet(HTML) 9 Page - Holtek Semiconductor Inc |
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9 / 10 page ![]() Carrier Tape Dimensions SSOP 16S Symbol Description Dimensions in mm W Carrier Tape Width 12.0+0.3 -0.1 P Cavity Pitch 8.0 ±0.1 E Perforation Position 1.75 ±0.1 F Cavity to Perforation (Width Direction) 5.5 ±0.1 D Perforation Diameter 1.55 ±0.1 D1 Cavity Hole Diameter 1.5+0.25 P0 Perforation Pitch 4.0 ±0.1 P1 Cavity to Perforation (Length Direction) 2.0 ±0.1 A0 Cavity Length 6.4 ±0.1 B0 Cavity Width 5.2 ±0.1 K0 Cavity Depth 2.1 ±0.1 t Carrier Tape Thickness 0.30 ±0.05 C Cover Tape Width 9.3 TSSOP 16L Symbol Description Dimensions in mm W Carrier Tape Width 16+0.3 -0.1 P Cavity Pitch 8 ±0.1 E Perforation Position 1.75 ±0.1 F Cavity to Perforation (Width Direction) 7.5 ±0.5 D Perforation Diameter 1.5+0.1 D1 Cavity Hole Diameter 1.5+0.1 P0 Perforation Pitch 4 ±0.1 P1 Cavity to Perforation (Length Direction) 2 ±0.1 A0 Cavity Length 6.8 ±0.1 B0 Cavity Width 5.4 ±0.1 K0 Cavity Depth 1.6 ±0.1 t Carrier Tape Thickness 0.3 ±0.013 C Cover Tape Width 13.3 HT82V805 Rev. 1.00 9 December 8, 2005 P D 1 W P 1 P 0 D E F t K 0 B 0 A 0 C |
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