ICS8530DYI01 datasheet(12/17 Pages) ICST

Part #	ICS8530DYI01

Description	LOW SKEW, 1-TO-16 DIFFERENTIAL-TO-3.3V LVPECL FANOUT BUFFER

PDF	17 Pages

Scroll/Zoom	100%

Manufacturer	ICST [Integrated Circuit Systems]

Direct Link	http://www.icst.com

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12 / 17 page

8530DYI-01

www.icst.com/products/hiperclocks.html

REV. A FEBRUARY 25, 2005

Integrated

Circuit

Systems, Inc.

ICS8530I-01

LOW SKEW, 1-TO-16

DIFFERENTIAL-TO-3.3V LVPECL FANOUT BUFFER

PRELIMINARY

EXPOSED PAD

Expose Metal Pad

(GROUND PAD)

GROUND PLANE

SOLDER

SIGNAL

TRACE

SIGNAL

TRACE

THERM AL VIA

SOLDER M ASK

FIGURE 4. P.C. BOARD FOR EXPOSED PAD THERMAL RELEASE PATH EXAMPLE

THERMAL RELEASE PATH

The expose metal pad provides heat transfer from the device to

the P.C. board. The expose metal pad is ground pad connected

to ground plane through thermal via. The exposed pad on the

device to the exposed metal pad on the PCB is contacted through

solder as shown in

Figure 4. For further information, please re-

fer to the Application Note on Surface Mount Assembly of

Amkor’s Thermally /Electrically Enhance Leadframe Base Pack-

age, Amkor Technology.

ICS8530DYI01 Datasheet(PDF) 12 Page - Integrated Circuit Systems