ADF4212LBRU datasheet(4/20 Pages) AD

4 / 20 page

REV. 0

ADF4212L

–4–

CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily

accumulate on the human body and test equipment and can discharge without detection. Although

the ADF4212L features proprietary ESD protection circuitry, permanent damage may occur on

devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are

recommended to avoid performance degradation or loss of functionality.

WARNING!

ESD SENSITIVE DEVICE

ABSOLUTE MAXIMUM RATINGS

1, 2, 3

(TA = 25

°C, unless otherwise noted.)

VDD1 to GND . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +3.6 V

VDD1 to VDD2 . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +0.3 V

VP1, VP2 to GND . . . . . . . . . . . . . . . . . . . . –0.3 V to +3.6 V

VP1, VP2 to VDD1, VDD2 . . . . . . . . . . . . . . . –0.3 V to +3.6 V

Digital I/O Voltage to GND . . . . . . –0.3 V to DVDD + 0.3 V

Analog I/O Voltage to GND . . . . . . . . –0.3 V to VDD + 0.3 V

REFIN, RFIN, IFIN to GND . . . . . . . –0.3 V to VDD + 0.3 V

Operating Temperature Range

Industrial (B Version) . . . . . . . . . . . . . . .

–40

°C to +85°C

Storage Temperature Range . . . . . . . . . . . . –65

°C to +150°C

Maximum Junction Temperature . . . . . . . . . . . . . . . . 150

°C

TSSOP JA Thermal Impedance . . . . . . . . . . . . . 150.4

°C/W

CSP JA Thermal Impedance (Paddle Soldered) . . . 122

°C/W

CSP JA Thermal Impedance (Paddle Not Soldered) 216

°C/W

Lead Temperature, Soldering

Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . 215

°C

Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220

°C

NOTES

1Stresses above those listed under Absolute Maximum Ratings may cause perma-

nent damage to the device. This is a stress rating only; functional operation of the

device at these or any other conditions above those listed in the operational sections

of this specification is not implied. Exposure to absolute maximum rating condi-

tions for extended periods may affect device reliability.

2This device is a high performance RF integrated circuit with an ESD rating of

<2 kV, and it is ESD sensitive. Proper precautions should be taken for handling and

assembly.

3GND = AGND = DGND = 0 V

ORDERING GUIDE

Model

Temperature Range

Package Option

ADF4212LBRU

–40

°C to +85°C

RU-20

ADF4212LBCP

–40

°C to +85°C

CP-20

*RU = Thin Shrink Small Outline Package (TSSOP)

CP = Chip Scale Package

Contact the factory for chip availability.

PIN CONFIGURATION

TSSOP

REFIN

CLK

DATA

MUXOUT

RFIN

CPRF

FLO

AGNDRF

VDD1

DGNDRF

VDD2

VP1

ADF4212L

DGNDIF

AGNDIF

IFIN

DGNDIF

CPIF

VP2

RSET

TOP VIEW

(Not To Scale)

LFCSP

FLO

RFIN

CPRF

AGNDRF

DGNDRF

RSET

AGNDIF

DGNDIF

IFIN

ADF4212L

CHIP SCALE

PACKAGE

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