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STE2007DIE2 Datasheet(PDF) 55 Page - STMicroelectronics |
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STE2007DIE2 Datasheet(HTML) 55 Page - STMicroelectronics |
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55 / 62 page  STE2007 9 Chip Mechanical Drawing 55/62 9 Chip Mechanical Drawing Table 54. Mechanical Dimensions Parameter Dimensions Wafer Thickness 500 µm Die Size (X x Y) 5.92 mm x 1.29 mm Bumps Size on Columns and Segments Side 28 µm X 89 µm X 15 Pad Size on Columns and Segments Side 35 µm X 96µm Bumps Pitch on Columns and Segments Side 45 µm Bumps Size on Interfaces Side 55 µm X 73µm X 15 Pad Size on Interfaces Side 64 µm X 82 µm Bumps Pitch on Interfaces Side 72 µm Spacing between Bumps 17 µm |
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