ADE9153AACPZ datasheet(8/50 Pages) AD

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ADE9153A

Data Sheet

Rev. 0 | Page 8 of 50

ABSOLUTE MAXIMUM RATINGS

TA = 25°C, unless otherwise noted.

Table 4.

Parameter

Rating

VDD to AGND/DGND

−0.3 V to +3.96 V

Analog Input Voltage to AGND/DGND,

IAP, IAN, IBP, IBN, VP, VN1

−0.75 V to +2.2 V

Reference Input Voltage to AGND/DGND

−0.3 V to +2.2 V

Digital Input Voltage to AGND/DGND

−0.3 V to +3.96 V

Digital Output Voltage to AGND/DGND

−0.3 V to +3.96 V

Operating Temperature

Industrial Temperature Range

−40°C to +85°C

Storage Temperature Range

−65°C to +150°C

Lead Temperature (Soldering, 10 sec)2

260°C

Electrostatic Discharge (ESD)

Human Body Model (HBM)

4 kV

Machine Model (MM)

200 V

Field Induced Charged Device Model

(FICDM)

1.25 kV

1 The rating of −0.75 V on the analog input pins is limited by protection

diodes inside the ADE9153A. These pins were tested with 7.5 mA going to

the pin to simulate a 30× overcurrent condition on the channel, based on

the test circuit antialiasing resistor of 150 Ω.

2 Analog Devices, Inc., recommends that reflow profiles used in soldering

RoHS-compliant devices conform to J-STD-020D.1 from JEDEC. Refer to

JEDEC for the latest revision of this standard.

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to

PCB thermal design is required.

θJA and θJC are specified for the worst-case conditions, that is, a

device soldered in a circuit board for surface-mount packages.

Table 5. Thermal Resistance

Package Type

θJA1

θJC2

Unit

CP-32-123

27.83

2.10

°C/W

1 The θJA measurement uses a 2S2P JEDEC test board.

2 The θJC measurement uses a 1S0P JEDEC test board.

3 All thermal measurements comply with JESD51.

ESD CAUTION

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