AS5600L datasheet(6/48 Pages) AMSCO

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[v1-12] 2020-May-14

AS5600L − Absolute Maximum R atings

Temperature Ranges and Storage Conditions

TSTRG

Storage temperature range

-55

125

°C

TBODY

Package body temperature

260

°C

SOIC-8: ICP/JEDEC J-STD-020

The reflow peak soldering

temperature (body temperature) is

specified according to IPC/JEDEC

J-STD-020 “Moisture/Reflow

Sensitivity Classification for

Non-hermetic Solid State Surface

Mount Devices.” The lead finish for

Pb-free leaded packages is “Matte

Tin” (100% Sn)

WL-CSP: ICP/JEDEC J-STD-020

The reflow peak soldering

temperature (body temperature) is

specified according to IPC/JEDEC

J-STD-020 “Moisture/Reflow

Sensitivity Classification for

Non-hermetic Solid State Surface

Mount Devices.”

RHNC

Relative humidity

(non-condensing)

585

MSL

Moisture sensitivity level

SOIC-8: ICP/JEDEC J-STD-033

WL-CSP: ICP/JEDEC J-STD-033

Symbol

Parameter

Min

Max

Units

Comments

AS5600L Datasheet(PDF) 6 Page - ams AG

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