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STM32G070CB Datasheet(PDF) 43 Page - STMicroelectronics

Part # STM32G070CB
Description  Arm® Cortex®-M0 32-bit MCU, 128 KB Flash, 36 KB RAM, 4x USART, timers, ADC, comm. I/Fs, 2.0-3.6V
PDF  93 Pages
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STM32G070CB Datasheet(HTML) 43 Page - STMicroelectronics

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DS12766 Rev 2
43/93
STM32G070CB/KB/RB
Electrical characteristics
80
5.3
Operating conditions
5.3.1
General operating conditions
5.3.2
Operating conditions at power-up / power-down
The parameters given in Table 21 are derived from tests performed under the ambient
temperature condition summarized in Table 20.
5.3.3
Embedded reset and power control block characteristics
The parameters given in Table 22 are derived from tests performed under the ambient
temperature conditions summarized in Table 20.
Table 19. Thermal characteristics
Symbol
Ratings
Value
Unit
TSTG
Storage temperature range
–65 to +150
°C
TJ
Maximum junction temperature
150
°C
Table 20. General operating conditions
Symbol
Parameter
Conditions
Min
Max
Unit
fHCLK
Internal AHB clock frequency
-
0
64
MHz
fPCLK
Internal APB clock frequency
-
0
64
VDD/DDA Supply voltage
-
2.0(1)
3.6
V
VBAT
Backup operating voltage
-
1.55
3.6
V
VIN
I/O input voltage
-
-0.3
Min(VDD + 3.6, 5.5)(2)
V
TA
Ambient temperature(3)
-
-40
85
°C
TJ
Junction temperature
-
-40
105
°C
1. When RESET is released functionality is guaranteed down to VPDR min.
2. For operation with voltage higher than VDD +0.3 V, the internal pull-up and pull-down resistors must be disabled.
3. The TA(max) applies to PD(max). At PD < PD(max) the ambient temperature is allowed to go higher than TA(max) provided
that the junction temperature TJ does not exceed TJ(max). Refer to Section 6.4: Thermal characteristics.
Table 21. Operating conditions at power-up / power-down
Symbol
Parameter
Conditions
Min
Max
Unit
tVDD
VDD slew rate
VDD rising
-
∞
µs/V
VDD falling
10
∞



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