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TDA7576B Datasheet(PDF) 14 Page - STMicroelectronics

Part # TDA7576B
Description  Dual bridge MOSFET power amplifier for 24 V systems
PDF  17 Pages
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

TDA7576B Datasheet(HTML) 14 Page - STMicroelectronics

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Functional description
TDA7576B
14/17
Doc ID 023511 Rev 3
6
Functional description
6.1
Diagnostics pins description
TDA7576B includes an offset detector pin and a clip detector and diagnostic pin.
DC offset detector is intended to avoid that an anomalous DC offset on the inputs of the
amplifier may be multiplied by the gain and result in a dangerous large offset on the outputs.
This may lead to speakers damage due to overheating.
The feature works with the amplifier unmuted and no signal at the inputs.
Moreover there is a pin named CD/Diag: the behavior of this pin is showed on Figure 4.
Whenever a failure condition (between thermal warning, output waveform clipping, short
circuit to GND or VCC) is verified by the IC the level of this pin goes true (low).
6.2
Thermal protections
Thermal protection function is triggered when junction temperature rises above the normal
operating range, thus avoiding chip damaging.
For behavior description, refer to Figure 4 and 12. When temperature is reaching thermal
warning (Tw = typ 140 °C) the CD/Diag pin is driven low. Thermal foldback begins limiting
the audio input to the amplifier stage, this effectively limits the output power capability of the
device thus reducing the temperature to acceptable levels without totally interrupting the
operation of the device. Thermal mute is temperature when -6 dB output attenuation is
reached (typical Tm = 160 °C).
The output power will decrease to the point at which thermal equilibrium is reached.
Thermal equilibrium will be reached when the reduction in output power reduces the
dissipated power such that the die temperature falls below the thermal foldback threshold.
Figure 12.
Thermal protection diagram



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