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WCMB2016R4X Datasheet(PDF) 4 Page - Weida Semiconductor, Inc. |
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WCMB2016R4X Datasheet(HTML) 4 Page - Weida Semiconductor, Inc. |
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4 / 11 page ![]() 4 WCMB2016R4X Notes: 6. Full device operation requires linear VCC ramp from VDR to VCC(min) > 100 µs or stable at VCC(min) > 100 µs. 7. BHE.BLE is the AND of both BHE and BLE. Chip can be deselected by either disabling the chip enable signals or by disabling both BHE and BLE. AC Test Loads and Waveforms VCC Typ VCC OUTPUT R2 30 pF INCLUDING JIG AND SCOPE GND 90% 10% 90% 10% OUTPUT V Equivalent to: THÉVENIN EQUIVALENT ALL INPUT PULSES RTH R1 Rise Time: 1 V/ns Fall Time: 1 V/ns Parameters 1.8V UNIT R1 13500 Ohms R2 10800 Ohms RTH 6000 Ohms VTH 0.80 Volts Data Retention Characteristics (Over the Operating Range) Parameter Description Conditions Min. Typ.[4] Max. Unit VDR VCC for Data Retention 1.0 1.95 V ICCDR Data Retention Current VCC = 1.0V CE > VCC − 0.2V, VIN > VCC − 0.2V or VIN < 0.2V 0.5 5 µA tCDR [5] Chip Deselect to Data Retention Time 0 ns tR [6] Operation Recovery Time tRC ns Data Retention Waveform[7] VCC(min.) VCC(min.) tCDR VDR > 1.0 V DATA RETENTION MODE tR CE or VCC BHE.BLE |
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