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NTLJS7D2P02P8Z Datasheet(PDF) 1 Page - ON Semiconductor

Part # NTLJS7D2P02P8Z
Description  MOSFET - Power, Single P-Channel, WDFN6 -20 V
PDF  6 Pages
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Manufacturer  ONSEMI [ON Semiconductor]
Direct Link  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

NTLJS7D2P02P8Z Datasheet(HTML) 1 Page - ON Semiconductor

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© Semiconductor Components Industries, LLC, 2018
August, 2020 − Rev. 0
1
Publication Order Number:
NTLJS7D2P02P8Z/D
MOSFET - Power, Single
P-Channel, WDFN6
-20 V
NTLJS7D2P02P8Z
Features
• Small Footprint (4 mm2) for Compact Design
• Low RDS(on) to Minimize Conduction Losses
• These Devices are Pb−Free, Halogen−Free/BFR−Free and are RoHS
Compliant
Applications
• Battery Management
• Protection
• Power Load Switch
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Parameter
Symbol
Value
Unit
Drain−to−Source Voltage
VDSS
−20
V
Gate−to−Source Voltage
VGS
±8.0
V
Continuous Drain Cur-
rent RqJA (Notes 1, 3)
Steady
State
TA = 25°C
ID
−13.1
A
TA = 85°C
−9.5
Power Dissipation
RqJA (Notes 1, 3)
TA = 25°C
PD
2.40
W
Continuous Drain Cur-
rent RqJA (Notes 2, 3)
Steady
State
TA = 25°C
ID
−7.9
A
TA = 85°C
−5.7
Power Dissipation
RqJA (Notes 2, 3)
TA = 25°C
PD
0.86
W
Pulsed Drain Current
TA = 25°C, tp = 10 ms
IDM
52
A
Operating Junction and Storage Temperature
Range
TJ, Tstg
−55 to
+150
°C
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
TL
260
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
THERMAL RESISTANCE MAXIMUM RATINGS (Note 1)
Parameter
Symbol
Value
Unit
Junction−to−Ambient − Steady State (Note 1)
RqJA
52
°C/W
Junction−to−Ambient − Steady State (Note 2)
RqJA
145
1. Surface−mounted on FR4 board using 1 in2 pad size, 2 oz. Cu pad.
2. Surface−mounted on FR4 board using minimum pad size, 2 oz. Cu pad.
3. The entire application environment impacts the thermal resistance values shown,
they are not constants and are only valid for the particular conditions noted.
Actual continuous current will be limited by thermal & electro−mechanical
application board design. RqCA is determined by the user’s board design.
www.onsemi.com
MARKING
DIAGRAM
See detailed ordering, marking and shipping information in the
package dimensions section on page 4 of this data sheet.
ORDERING INFORMATION
WDFN6 (2.05x2.05)
CASE 483AV
G
S
P−CHANNEL MOSFET
D
ELECTRICAL CONNECTION
−20 V
11 mW @ −2.5 V
9 mW @ −4.5 V
RDS(on) MAX
−13.1 A
ID MAX
V(BR)DSS
YWZZ
A7D2
YW = Date Code
ZZ = Assembly Lot Code
A
= Assembly Site Code
7D2 = Specific Device Code


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