STM32L053C6 datasheet(83/136 Pages) STMICROELECTRONICS

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DS10152 Rev 9

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STM32L053x6 STM32L053x8

Electrical characteristics

113

Designing hardened software to avoid noise problems

EMC characterization and optimization are performed at component level with a typical

application environment and simplified MCU software. It should be noted that good EMC

performance is highly dependent on the user application and the software in particular.

Therefore it is recommended that the user applies EMC software optimization and

prequalification tests in relation with the EMC level requested for his application.

Software recommendations

The software flowchart must include the management of runaway conditions such as:

•

Corrupted program counter

•

Unexpected reset

•

Critical data corruption (control registers...)

Prequalification trials

Most of the common failures (unexpected reset and program counter corruption) can be

reproduced by manually forcing a low state on the NRST pin or the oscillator pins for 1

second.

To complete these trials, ESD stress can be applied directly on the device, over the range of

specification values. When unexpected behavior is detected, the software can be hardened

to prevent unrecoverable errors occurring (see application note AN1015).

Electromagnetic Interference (EMI)

The electromagnetic field emitted by the device are monitored while a simple application is

executed (toggling 2 LEDs through the I/O ports). This emission test is compliant with

IEC 61967-2 standard which specifies the test board and the pin loading.

Table 54. EMI characteristics

Symbol Parameter

Conditions

Monitored

frequency band

Max vs. fosc/fCPU

Unit

8 MHz/

4 MHz

8 MHz/

16 MHz

8 MHz/

32 MHz

SEMI

Peak level

VDD = 3.6 V,

TA = 25 °C,

compliant with IEC

61967-2

0.1 to 30 MHz

-21

-15

-12

dBµV

30 to 130 MHz

-14

-12

-1

130 MHz to 1GHz

-10

-11

-7

EMI Level

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