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STM32L051C8 Datasheet(PDF) 105 Page - STMicroelectronics |
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STM32L051C8 Datasheet(HTML) 105 Page - STMicroelectronics |
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105 / 133 page ![]() DS10184 Rev 10 105/133 STM32L051x6 STM32L051x8 Package information 125 Figure 41. TFBGA64 – 64-ball, 5 x 5 mm, 0.5 mm pitch, thin profile fine pitch ball ,grid array recommended footprint ddd - - 0.080 - - 0.0031 eee - - 0.150 - - 0.0059 fff - - 0.050 - - 0.0020 1. Values in inches are converted from mm and rounded to 4 decimal digits. Table 73. TFBGA64 recommended PCB design rules (0.5 mm pitch BGA) Dimension Recommended values Pitch 0.5 Dpad 0.280 mm Dsm 0.370 mm typ. (depends on the soldermask registration tolerance) Stencil opening 0.280 mm Stencil thickness Between 0.100 mm and 1.125 mm Pad trace width 0.100 mm Table 72. TFBGA64 – 64-ball, 5 x 5 mm, 0.5 mm pitch thin profile fine pitch ball grid array package outline (continued) Symbol millimeters inches(1) Min Typ Max Min Typ Max |
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