| Electronic Components Datasheet Search |
|
STM32L051C8 Datasheet(PDF) 115 Page - STMicroelectronics |
|
|
|||||||||||||||||||||||||||||
STM32L051C8 Datasheet(HTML) 115 Page - STMicroelectronics |
|
115 / 133 page ![]() DS10184 Rev 10 115/133 STM32L051x6 STM32L051x8 Package information 125 7.6 Thin WLCSP36 package information Figure 51. Thin WLCSP36 - 2.61 x 2.88 mm, 0.4 mm pitch wafer level chip scale package outline 1. Drawing is not to scale. 2. b dimensions is measured at the maximum bump diameter parallel to primary datum Z. 3. Primary datum Z and seating plane are defined by the spherical crowns of the bump. 4. Bump position designation per JESD 95-1, SPP-010. |
|
Link URL |
| Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link to Datasheet | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |