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STM32L010K4 Datasheet(PDF) 83 Page - STMicroelectronics |
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STM32L010K4 Datasheet(HTML) 83 Page - STMicroelectronics |
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83 / 91 page  DS12323 Rev 3 83/91 STM32L010F4/K4 Package information 89 Figure 29. TSSOP20 – 20-lead thin shrink small outline, 6.5 x 4.4 mm, 0.65 mm pitch, package footprint 1. Dimensions are expressed in millimeters. L 0.450 0.600 0.750 0.0177 0.0236 0.0295 L1 - 1.000 - - 0.0394 - k0° - 8° 0° - 8° aaa - - 0.100 - - 0.0039 1. Values in inches are converted from mm and rounded to four decimal digits. 2. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs shall not exceed 0.15mm per side. 3. Dimension “E1” does not include interlead flash or protrusions. Interlead flash or protrusions shall not exceed 0.25mm per side. Table 60. TSSOP20 – 20-lead thin shrink small outline, 6.5 x 4.4 mm, 0.65 mm pitch, package mechanical data (continued) Symbol millimeters inches(1) Min. Typ. Max. Min. Typ. Max. YA_FP_V1 7.10 4.40 0.25 0.25 6.25 1.35 0.40 0.65 1.35 1 20 11 10 |
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