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ADMV8913SCCZ-EP-R2 Datasheet(PDF) 14 Page - Analog Devices |
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ADMV8913SCCZ-EP-R2 Datasheet(HTML) 14 Page - Analog Devices |
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14 / 23 page ![]() ADMV8913-EP Enhanced Product Rev. 0 | Page 14 of 23 APPLICATIONS INFORMATION PRINTED CIRCUIT BOARD (PCB) DESIGN GUIDELINES The PCB used to implement the ADMV8913-EP must use a high quality dielectric material between the top metallization layer and internal ground layer, such as the Rogers 4003 or the Rogers 4350. All other dielectric layers of the PCB can be standard material, such as the Isola 370HR. The characteristic impedance of the transmission lines to the RF1 and RF2 pins of the ADMV8913-EP must be carefully controlled to 50 Ω to ensure optimal RF performance. Connect the GND pins and exposed pad of the ADMV8913-EP directly to the ground plane of the PCB. Use a sufficient number of via holes to connect the top and bottom ground planes of the PCB. |
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