MIC79050 datasheet(5/28 Pages) MICROCHIP

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DS20005771B-page 5

MIC79050

TEMPERATURE SPECIFICATIONS (Note 1)

Parameters

Sym.

Min.

Typ.

Max.

Units

Conditions

Temperature Ranges

Junction Operating Temperature

Range

–40

—

+125

°C

—

Storage Temperature Range

–65

—

+150

°C

—

Lead Temperature

—

+260

°C

Soldering, 5s

Package Thermal Resistances (Note 2)

Thermal Resistance MSOP-8

JA

—

°C/W —

Thermal Resistance SOIC-8

JA

—

°C/W —

Thermal Resistance SOT-223

JC

—

°C/W —

JA

—

°C/W —

Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable

junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the

maximum allowable power dissipation will cause the device operating junction temperature to exceed the

maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.

2: The maximum allowable power dissipation at any TA (ambient temperature) is calculated using: PD(max) =

(TJ(max) – TA) ÷ θJA. Exceeding the maximum allowable power dissipation will result in excessive die tem-

perature, and the regulator will go into thermal shutdown.

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