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2022 Microchip Technology Inc. and its subsidiaries

DS20006650A-page 13

SY88403BL

16-Lead QFN Package Outline and Recommended Land Pattern

B

A

0.05 C

0.05 C

0.10

C A B

0.05

C

C

2X

TOP VIEW

SIDE VIEW

BOTTOM VIEW

1

2

N

0.10

C A B

0.10

C A B

0.10 C

0.08 C

Sheet 1 of 2

2X

16X

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

16-Lead Very Thin Plastic Quad Flat, No Lead Package (NCA) - 3x3x1.0 mm Body [VQFN]

With 1.55 mm Exposed Pad

Note:

Microchip Technology Drawing C04-1103-NCA Rev B

NOTE1

(DATUM B)

(DATUM A)

NOTE 1

SEATING

PLANE

A1

(A3)

A

D

E

D2

E2

(K)

16X b

e

e

2

L

1

2

N