TP5335

DS20005704D-page 8

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3-Lead TO-236AB (SOT-23) Package Outline (K1/T)

2.90x1.30mm body, 1.12mm height (max), 1.90mm pitch

Symbol

A

A1

A2

b

D

E

E1

e

e1

L

L1

Dimension

(mm)

MIN

0.89

0.01

0.88

0.30

2.80

2.10

1.20

0.95

BSC

1.90

BSC

0.54

REF

NOM

-

-

0.95

-

2.90

-

1.30

0.50

-

MAX

1.12

0.10

1.02

0.50

3.04

2.64

1.40

0.60

JEDEC Registration TO-236, Variation AB, Issue H, Jan. 1999.

† This dimension differs from the JEDEC drawing.

Drawings not to scale.

View B

View A - A

Side View

Top View

View B

Gauge

Plane

Seating

Plane

0.25

L1

L

E1 E

D

3

1

2

e

e1

b

A

A

Seating

Plane

A

A2

A1

Note: For the most current package drawings, see the Microchip Packaging Specification at www.microchip.com/packaging.

Note: For the most current package drawings, see the Microchip Packaging Specification at www.microchip.com/packaging.