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2009B Datasheet(PDF) 4 Page - Shenzhen Tuofeng Semiconductor Technology Co |
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2009B Datasheet(HTML) 4 Page - Shenzhen Tuofeng Semiconductor Technology Co |
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4 / 5 page ![]() www.sztuofeng.com Feb,2018 V1.0 4 TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS 0 1 2 3 4 5 02 46 8 10 Qg (nC) Figure 7: Gate-Charge Characteristics VDS=4.5V ID=6A 0 200 400 600 800 1000 1200 1400 0 5 10 15 20 VDS(Volts) Figure 8: Capacitance Characteristics Ciss Crss Coss 0 10 20 30 40 0.001 0.01 0.1 1 10 100 1000 Pulse Width (s) Figure 10: Single Pulse Power Rating Junction-to- Ambient (Note E) TJ(Max)=150°C TA=25°C 0.01 0.1 1 10 0.00001 0.0001 0.001 0.01 0.1 1 10 100 1000 Pulse Width (s) Figure 11: Normalized Maximum Transient Thermal Impedance Ton T PD D=Ton/T TJ,PK=TA+PDM.ZθJA.RθJA RθJA=83°C/W In descending order D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse 0.1 1 10 100 0.1 1 10 100 VDS (Volts) Figure 9: Maximum Forward Biased Safe Operating Area (Note E) 10µs 100µs 10ms 1ms DC RDS(ON) limited TJ(Max)=150°C, TA=25°C 100m 1s 10s SHENZHEN TUOFENG SEMICONDUCTOR TECHNOLOGY CO.,LTD DFN-3x3-8L Plastic-Encapsulate MOSFETS 2009B |
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