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PIC16F87-I/ML Datasheet(PDF) 199 Page - Microchip Technology

Part # PIC16F87-I/ML
Description  18/20/28-Pin Enhanced FLASH Microcontrollers with nanoWatt Technology
PDF  214 Pages
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Manufacturer  MICROCHIP [Microchip Technology]
Direct Link  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

PIC16F87-I/ML Datasheet(HTML) 199 Page - Microchip Technology

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 2003 Microchip Technology Inc.
Preliminary
DS30487B-page 197
PIC16F87/88
28-Lead Plastic Quad Flat No Lead Package (ML) 6x6 mm Body, Punch Singulated (QFN)
Lead Width
*Controlling Parameter
Drawing No. C04-114
Notes:
Mold Draft Angle Top
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed .010" (0.254mm) per side.
B
α
.009
12°
.011
.014
0.23
12°
0.28
0.35
Pitch
Number of Pins
Overall Width
Standoff
Molded Package Length
Overall Length
Molded Package Width
Molded Package Thickness
Overall Height
MAX
Units
Dimension Limits
A2
A1
E1
D
D1
E
n
p
A
.026
.236 BSC
.000
.226 BSC
INCHES
.026 BSC
MIN
28
NOM
MAX
0.65
.031
.002
0.00
6.00 BSC
5.75 BSC
MILLIMETERS*
.039
MIN
28
0.65 BSC
NOM
0.80
0.05
1.00
.008 REF
Base Thickness
A3
0.20 REF
JEDEC equivalent: mMO-220
0.85
.033
.0004
0.01
.236 BSC
.226 BSC
6.00 BSC
5.75 BSC
Lead Length
Tie Bar Width
L
.020
.024
.030
0.50
0.60
0.75
R
.005
.007
.010
0.13
0.17
0.23
Tie Bar Length
Q
.012
.016
.026
0.30
0.40
0.65
Chamfer
CH
.009
.017
.024
0.24
0.42
0.60
E2
D2
Exposed Pad Width
Exposed Pad Length
.140
.146
.152
3.55
3.70
3.85
.140
.146
.152
3.55
3.70
3.85
D
E
E1
n
1
2
D1
A
A2
EXPOSED
METAL
PADS
BOTTOM VIEW
TOP VIEW
Q
L
R
p
A1
A3
α
CH X 45°
B
D2
E2



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