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STTH30RQ06L2 Datasheet(PDF) 7 Page - STMicroelectronics |
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STTH30RQ06L2 Datasheet(HTML) 7 Page - STMicroelectronics |
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7 / 12 page ![]() Table 5. HU3PAK package mechanical data Ref. Dimensions mm Min. Typ. Max. A 3.40 3.50 3.60 A1 0.05 b 0.50 0.60 0.70 b2 0.50 0.70 1.00 b3 0.80 0.90 1.00 c 0.40 0.50 0.60 c2 0.40 0.50 0.60 D 11.70 11.80 11.90 D1 8.80 8.955 9.10 E 13.90 14.00 14.10 E1 12.30 12.40 12.50 E2 7.75 7.80 7.85 e BSC 1.27 H 18.00 18.58 19.00 L 2.40 2.52 2.60 L1 3.05 L2 0.90 1.00 1.10 L3 BSC 0.26 L4 0.075 0.125 0.175 L5 1.83 1.93 2.03 L6 2.14 2.24 2.34 L7 4.44 4.54 4.64 aaa 0.10 F1 2.90 3.00 3.10 F2 2.40 2.50 2.60 F3 0.25 0.35 0.45 N1 3.80 3.90 4.00 N2 0.25 0.30 0.45 N3 0.80 0.90 1.00 T 0.50 0.67 0.70 T2 9.18 9.38 9.43 θ1 0° 8° θ2 0° 8° 1. Package outline exclusive of any mold flashes dimensions. 2. Package outline exclusive of burr dimensions. 3. Max resin gate protrusion: 0.25 mm. 4. The planarity of the package backside 50 micron max. 5. BSC: basic spacing between centers STTH30RQ06L2 HU3PAK package information DS13275 - Rev 3 page 7/12 |
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