STA5635A datasheet(1/20 Pages) STMICROELECTRONICS

Part #	STA5635A

Description	Automotive Universal GNSS RF Receiver

PDF	20 Pages

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Manufacturer	STMICROELECTRONICS [STMicroelectronics]

Direct Link	http://www.st.com

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This is information on a product in full production.

December 2020

DS12858 Rev 2

1/20

STA5635A

Automotive Universal GNSS RF Receiver

Datasheet

- production data

Features

 AEC-Q100 qualified

 Multi GNSS band support (L1/E1, L2C,

L5/E5/E6/L6 and L band)

 Programmable IF bandwidth (7 or 13 MHz

range)

 1.62 V to 3.6 V supply voltage range

 Smart digital interface (JESD207-

COMPATIBLE)

 Fractional-N synthesizer with embedded loop

filter

 SPI interface for full programmability and

interface to transmit L-band data bit

 2 Bit A/D converter

 Operating temperature (-40 °C, 105 °C)

 CMOS040 technology

 QFN5x5 32leads package

Description

The chip is a fully integrated RF front-end able to

support different bands (L1, L2, L5, L6 and L)

thanks to a programmable and flexible RF-IF

chain driven by a fractional PLL. In particular,

G5RF is able to manage all the GNSS

constellations available and planned in the next

future like GPS, Galileo, Glonass, BeiDou, IRNSS

and QZSS.

The RF_IF chain is followed from a 2-bit ADC

able to convert the IF signal to Sign (SIGN) and

Magnitude (MAG) bit. The MAG bit is internally

integrated in order to control the variable gain

amplifiers. The VGA gain can be also set by the

SPI interface.

Further, it is able to manage L-band signal from

1525 to 1559 MHz, in this case a dedicated 10bit

ADC is used and the SPI interface to transmit low

data rate data in L band support.

A digital interface, JESD207 compliant, is used

only to transmit GNSS data and clock to external

baseband.

The embedded fractional PLL allows supporting a

wide range of reference clocks (10 to 55 MHz)

and generates a sampling clock available for the

baseband.

The STA5635A embeds two LDOs to supply at

1.1 V the analog and digital cores of the device

facilitating requirements to external power supply.

A third LDO can be turned-on to supply at 1.8 V

external active components as a TCXO.

The chip is manufactured in CMOS040nm

Technology and housed in a QFN package.

www.st.com

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