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STL64N4F7AG Datasheet(PDF) 3 Page - STMicroelectronics |
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STL64N4F7AG Datasheet(HTML) 3 Page - STMicroelectronics |
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3 / 15 page ![]() 2 Electrical characteristics (TC = 25 °C unless otherwise specified) Table 3. On-/off-states Symbol Parameter Test conditions Min. Typ. Max. Unit V(BR)DSS Drain-source breakdown voltage VGS = 0 V, ID= 1 mA 40 V IDSS Zero gate voltage drain current VGS = 0 V, VDS= 40 V 1 µA IGSS Gate-body leakage current VGS = 20 V, VDS = 0 V 100 nA VGS(th) Gate threshold voltage VDS = VGS, ID = 250 μA 2 4 V RDS(on) Static drain-source on-resistance VGS = 10 V, ID = 32 A 7.0 8.5 mΩ Table 4. Dynamic Symbol Parameter Test conditions Min. Typ. Max. Unit Ciss Input capacitance VDS = 25 V, f = 1 MHz, VGS= 0 V - 637 - pF Coss Output capacitance - 240 - pF Crss Reverse transfer capacitance - 26 - pF Qg Total gate charge VDD = 20 V, ID = 64 A, VGS = 0 to 10 V (see Figure 13. Test circuit for gate charge behavior) - 9.8 - nC Qgs Gate-source charge - 3.8 - nC Qgd Gate-drain charge - 3.1 - nC Table 5. Switching times Symbol Parameter Test conditions Min. Typ. Max. Unit td(on) Turn-on delay time VDD = 20 V, ID = 32 A, RG = 4.7 Ω, VGS = 10 V (see Figure 12. Test circuit for resistive load switching times and Figure 17. Switching time waveform) - 18.8 - ns tr Rise time - 102.6 - ns td(off) Turn-off delay time - 21.4 - ns tf Fall time - 13.3 - ns Table 6. Source-drain diode Symbol Parameter Test conditions Min. Typ. Max. Unit VSD (1) Forward on voltage ISD = 64 A, VGS = 0 V - 1.3 V trr Reverse recovery time ID = 64 A, di/dt = 100 A/µs VDD = 32 V (see Figure 14. Test circuit for inductive load switching and diode recovery times) - 27.5 ns Qrr Reverse recovery charge - 17.3 nC IRRM Reverse recovery current - 1.4 A 1. Pulsed: pulse duration = 300 µs, duty cycle 1.5% STL64N4F7AG Electrical characteristics DS12596 - Rev 2 page 3/15 |
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