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K4M561633G-RBL Datasheet(PDF) 4 Page - Samsung semiconductor |
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K4M561633G-RBL Datasheet(HTML) 4 Page - Samsung semiconductor |
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4 / 12 page ![]() K4M561633G - R(B)N/G/L/F January 2006 Mobile SDRAM DC OPERATING CONDITIONS Recommended operating conditions (Voltage referenced to VSS = 0V, TA = -25 ~ 85 °C for Extended, -25 ~ 70°C for Commercial) NOTES : 1. Under all conditions VDDQ must be less than or equal to VDD. 2. VIH (max) = 5.3V AC.The overshoot voltage duration is ≤ 3ns. 3. VIL (min) = -2.0V AC. The undershoot voltage duration is ≤ 3ns. 4. Any input 0V ≤ VIN ≤ VDDQ. Input leakage currents include Hi-Z output leakage for all bi-directional buffers with tri-state outputs. 5. Dout is disabled, 0V ≤ VOUT ≤ VDDQ. Parameter Symbol Min Typ Max Unit Note Supply voltage VDD 2.7 3.0 3.6 V 1 VDDQ 2.7 3.0 3.6 V 1 Input logic high voltage VIH 2.2 3.0 VDDQ + 0.3 V 2 Input logic low voltage VIL -0.3 0 0.5 V 3 Output logic high voltage VOH 2.4 - - V IOH = -2mA Output logic low voltage VOL - - 0.4 V IOL = 2mA Input leakage current ILI -10 - 10 uA 4 CAPACITANCE (VDD = 3.0V & 3.3V, TA = 23°C, f = 1MHz, VREF =0.9V ± 50 mV) Pin Symbol Min Max Unit Note Clock CCLK 1.5 3.5 pF RAS, CAS, WE, CS, CKE, DQM CIN 1.5 3.0 pF Address CADD 1.5 3.0 pF DQ0 ~ DQ15 COUT 2.0 4.5 pF ABSOLUTE MAXIMUM RATINGS NOTES: Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are exceeded. Functional operation should be restricted to recommended operating condition. Exposure to higher than recommended voltage for extended periods of time could affect device reliability. Parameter Symbol Value Unit Voltage on any pin relative to Vss VIN, VOUT -1.0 ~ 4.6 V Voltage on VDD supply relative to Vss VDD, VDDQ -1.0 ~ 4.6 V Storage temperature TSTG -55 ~ +150 °C Power dissipation PD 1.0 W Short circuit current IOS 50 mA |
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