ZXGD3108N8

Document Number DS36530 Rev. 3 - 2

2 of 10

www.diodes.com

April 2017

© Diodes Incorporated

ZXGD3108N8

Absolute Maximum Ratings (Voltage relative to GND, @ TA = +25°C, unless otherwise specified.)

Characteristic

Symbol

Value

Unit

Supply Voltage

VCC

25

V

Drain Pin Voltage

VD

-3 to 40

V

Gate Output Voltage

VG

-3 to VCC +3

V

Gate Driver Peak Source Current

ISOURCE

2

A

Gate Driver Peak Sink Current

ISINK

5

A

Thermal Characteristics (@ TA = +25°C, unless otherwise specified.)

Characteristic

Symbol

Value

Unit

Power Dissipation

Linear Derating Factor

(Note 5)

PD

490

3.92

mW

mW/°C

(Note 6)

655

5.24

(Note 7)

720

5.76

(Note 8)

785

6.28

Thermal Resistance, Junction to Ambient

(Note 5)

RθJA

255

°C/W

(Note 6)

191

(Note 7)

173

(Note 8)

159

Thermal Resistance, Junction to Lead

(Note 9)

RθJL

135

°C/W



Operating and Storage Temperature Range

TJ, TSTG

-50 to +150

°C

ESD Ratings (Note 10)

Characteristic

Symbol

Value

Unit

JEDEC Class

Electrostatic Discharge

– Human Body Model

ESD HBM

2,000

V

2

Electrostatic Discharge

– Machine Model

ESD MM

200

V

B

Notes:

5. For a device surface mounted on minimum recommended pad layout FR4 PCB with high coverage of single sided 1oz copper, in still air conditions; the

device is measured when operating in a steady-state condition.

6. Same as Note (5), except pins 2 & 3 (GND) and pins 5 & 6 (VCC) are both connected to separate 5mm x 5mm 1oz copper heat-sinks.

7. Same as Note (6), except both heat-sinks are 10mm x 10mm.

8. Same as Note (6), except both heat-sinks are 15mm x 15mm.

9. Thermal resistance from junction to solder-point at the end of each lead on pins 2 & 3 (GND) and pins 5 & 6 (VCC).

10. Refer to JEDEC specification JESD22-A114 and JESD22-A11

Thermal Derating Curve

0

20

40

60

80

100

120

140

160

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

15mm x 15mm

5mm x 5mm

Minimum

Layout

Derating Curve

Junction Temperature (°C)

10mm x 10mm