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SPC574S60 Datasheet(PDF) 26 Page - STMicroelectronics

Part # SPC574S60
Description  32-bit Power Architecture microcontroller for automotive ASILD applications
PDF  77 Pages
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

SPC574S60 Datasheet(HTML) 26 Page - STMicroelectronics

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Electrical characteristics
SPC574Sx
26/77
DS10601 Rev 6
3.9
I/O pad electrical characteristics
3.9.1
I/O pad types
Table 11 describes the different pad type configurations.
Table 10. Current consumption
Use Case(1)
Conditions
Regulator
Mode
C
IDD_LV
IDD_HV
Unit
Full function(2)
F1(3) (system clock freq) = 140 MHz
F0(4) (motor clock freq) = 120 MHz
Internal
P
310
mA
External
P
265
55
mA
F1(3) (system clock freq) = 100 MHz
F0(4) (motor clock freq) = 84 MHz
Internal
T
265
mA
External
T
210
55
mA
F1(3) (system clock freq) = 70 MHz
F0(4) (motor clock freq) = 60 MHz
Internal
T
230
mA
External
T
175
55
mA
Stop mode
—
Internal
C
110
mA
External
C
100
30
mA
Full Self test
(semi-parallel)
LBIST configuration = L0//L1 + L2//L3
MBIST configuration = parallel
Freq = 35 MHz (PLL)
Internal
C
240
mA
External
C
230
15
mA
Full Self test
(parallel)
LBIST configuration = parallel
MBIST configuration = parallel
Freq = 16 MHz (RCOSC)
Internal
C
215
mA
External
C
205
15
mA
1. The IDD values are based on the following operating conditions: TJ = 150 °C, HV = 5.5 V, LV = 1.32 (external regulator
mode).
2. Values are based on typical application code executing from Flash memory, where the DMA is running in continuous mode,
the ADC is in continuous conversion, the timers are running to maximum counter values and communication IPs are in
loopback or transmitting mode. IOs are unloaded.
3. F1 stands for System clock frequency.
4. F0 stands for Motor clock frequency.
Table 11. I/O pad specification descriptions
Pad type
Description
Slow configuration
Provides a good compromise between transition time and low electromagnetic emission.
Pad impedance is centered around 800
Ω
Medium configuration
Provides transition fast enough for the serial communication channels with controlled
current to reduce electromagnetic emission. Pad impedance is centered around 200
Ω
Fast configuration
Provides fast transition speed; used for fast interface. Pad impedance is centered
around 50
Ω
Very fast configuration
Provides maximum speed and controlled symmetric behavior for rise and fall transition.
Used for fast interfaces, like FlexRay, requiring fine control of rising/falling edge jitter.
Pad impedance is centered around 40
Ω
Input only pads
These pads are associated to ADC channels and the external 8-40 MHz crystal oscillator
(XOSC) providing low input leakage



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