SRP1038WA Series - Shielded Power Inductors

Features

n

Shielded construction for low radiation

n

Metal alloy powder core for high

saturation current

n

Wide side terminal for enhanced

mechanical strength

n

High vibration resistance (15 G typical,

30 G peak)

n

High operating temperature

n

Low buzz noise

n

AEC-Q200 compliant

n

RoHS compliant* and halogen free**

Electrical Specifications @ 25 °C

Bourns Part No.

Inductance

@ 100 kHz / 1 V Q Typ.

@

100 kHz

SRF

(MHz)

Typ.

DCR

(mW)

Typ.

DCR

(mW)

Max.

Irms

(A)

Typ.

Isat

(A)

Typ.

L (mH) Tol. %

SRP1038WA-R47M

0.47

20

15

60

1.42

1.63

34

31

SRP1038WA-R56M

0.56

20

15

55

1.7

2

32

29

SRP1038WA-R68M

0.68

20

15

51

2.0

2.3

31

28

SRP1038WA-R78M

0.78

20

15

48

2.3

2.5

30

27

SRP1038WA-R82M

0.82

20

15

44

2.4

2.7

27

26.5

SRP1038WA-1R0M

1.00

20

20

42

2.7

3.1

25

26

SRP1038WA-1R5M

1.50

20

20

32

3.9

4.5

22

24

SRP1038WA-1R8M

1.80

20

20

30

4.4

5.5

20

23

SRP1038WA-2R2M

2.20

20

20

26

5.3

6.1

18

19

SRP1038WA-3R3M

3.30

20

20

19

9.0

10.4

15

17

SRP1038WA-4R7M

4.70

20

20

16

13.4

15

11

13.5

SRP1038WA-5R6M

5.60

20

20

13

15.4

17

10.5

12

SRP1038WA-6R8M

6.80

20

20

12

17

19

10

11

SRP1038WA-8R2M

8.20

20

20

12

23

25.3

8.5

9.0

SRP1038WA-100M 10.00

20

20

11

27

30

8

8.2

SRP1038WA-120M 12.00

20

20

10

29

33.4

7.4

7.5

SRP1038WA-150M 15.00

20

20

8

40

45

6.4

7.0

SRP1038WA-220M 22.00

20

20

7

59

68

5.5

6.0

SRP1038WA-330M 33.00

20

20

6

89

102

4.7

4.8

SRP1038WA-470M 47.00

20

20

5

143

165

3.6

4.0

General Specifications

Operating Temperature

.................................. -55 °C to +165 °C

(Temperature rise included)

Storage Temperature (Component)

...................................... -55 °C to +165 °C

Temperature Rise ... 40 °C at rated Irms1

Rated Current

............. Inductance drops 30 % at Isat

Moisture Sensitivity Level......................1

ESD Classification (HBM)..................N/A

1 Circuit design, component, PCB trace size and

thickness, airflow and other cooling provisions

all affect the part temperature. Part temperature

should be verified in the end application.

Materials

Core...........................Metal alloy powder

Wire .............................Enameled copper

Terminal Finish ................................... Sn

Packaging........ 500 pcs. per 13-inch reel

Soldering Profile

25

245

Time (Seconds)

REFLOW TIMES: 3 TIMES MAX.

PREHEAT AREA

MAX. RAMP UP RATE = 3 °C/SEC.

MAX. RAMP DOWN RATE = 6 °C/SEC.

Time 25 °C to Peak

8 Minutes Max.

TC -5 °C

200 °C

60~150

Sec.

217

150°C

60~120

Sec.

<30 Sec.

Profile Feature

Pb Free Assembly

Preheat

- Temperature Min. (Tsmin)

- Temperature Max. (Tsmax)

- Time(ts) from Tsmin to Tsmax

150 °C

200 °C

60-120 seconds

Ramp-up Rate (TL to Tp)

3 °C/second max.

Liquidous temperature (TL)

Time (tL) maintained above TL

217 °C

60-150 seconds

Peak package body temperature (Tp)

245 °C

Time within 5 °C of Actual Peak Temperature

(tp)

<30 seconds

Ramp-Down Rate (Tp to TL)

6 °C/second max.

Time 25 °C to Peak Temperature

8 minutes max.

* RoHS Directive 2015/863, Mar 31, 2015 and Annex.

** Bourns considers a product to be “halogen free” if (a) the Bromine (Br) content is 900 ppm or less; (b) the Chlorine (Cl) content is 900 ppm or less; and (c) the total Bromine (Br)

and Chlorine (Cl) content is 1500 ppm or less.

Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are

subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.

WARNING Cancer and Reproductive Harm

www.P65Warnings.ca.gov

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