APM2504NU datasheet(2/10 Pages) ANPEC

2 / 10 page

Rev. B.1 - May., 2005

www.anpec.com.tw

APM2504NU

Absolute Maximum Ratings

Symbol

Parameter

Rating

Unit

Common Ratings (TA = 25°C)

VDSS

Drain-Source Voltage

VGSS

Gate-Source Voltage

±20

Diode Continuous Forward Current

Maximum Junction Temperature

150

°C

TSTG

Storage Temperature Range

-55 to 150

°C

Mounted on Large Heat Sink

TC=25°C

180

IDP

300

ìs Pulse Drain Current Tested

TC=100°C

100

TC=25°C

Continuous Drain Current

TC=100°C

TC=25°C

Maximum Power Dissipation

TC=100°C

RθJC

Thermal Resistance-Junction to Case

2.5

°C/W

Mounted on PCB of 1in

2 Pad Area

TA=25°C

180

IDP

300

ìs Pulse Drain Current Tested

TA=100°C

100

TA=25°C

Continuous Drain Current

TA=100°C

TA=25°C

2.5

Maximum Power Dissipation

TA=100°C

RθJA

Thermal Resistance-Junction to Ambient

°C/W

Mounted on PCB of Minimum Footprint

TA=25°C

180

IDP

300

ìs Pulse Drain Current Tested

TA=100°C

100

TA=25°C

Continuous Drain Current

TA=100°C

TA=25°C

1.6

°C/W

Maximum Power Dissipation

TA=100°C

0.6

°C/W

RθJA

Thermal Resistance-Junction to Ambient

°C/W

Note:

* Current limited by bond wire.

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