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AP62250 Datasheet(PDF) 13 Page - Diodes Incorporated

Part # AP62250
Description  4.2V TO 18V INPUT, 2.5A LOW IQ SYNCHRONOUS BUCK CONVERTER
PDF  21 Pages
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Manufacturer  DIODES [Diodes Incorporated]
Direct Link  http://www.diodes.com
Logo DIODES - Diodes Incorporated

AP62250 Datasheet(HTML) 13 Page - Diodes Incorporated

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AP62250
Document number: DS42701 Rev. 2 - 2
13 of 21
www.diodes.com
January 2021
© Diodes Incorporated
AP62250
Application Information (continued)
6
Overcurrent Protection (OCP)
The AP62250 has cycle-by-cycle valley current limit protection by sensing the current through the internal low-side power MOSFET, Q2. While Q2
is on, the internal sensing circuitry monitors its conduction current. The overcurrent limit has a corresponding voltage limit, VLIMIT. When the
voltage between GND and SW is lower than VLIMIT due to excessive current through Q2, the OCP triggers, and the controller turns off Q2. During
this time, both Q1 and Q2 remain off. A new switching cycle begins only when the voltage between GND and SW rises above VLIMIT. If Q2
consistently hits the valley current limit for 2.5ms, the buck converter enters hiccup mode and shuts down. After 20ms of down time, the buck
converter restarts powering up. Hiccup mode reduces the power dissipation in the overcurrent condition.
Because the RDS(ON) values of the power MOSFETs increase with temperature, VLIMIT has a temperature coefficient of 0.4%/°C to compensate for
the temperature dependency of RDS(ON).
7
Thermal Shutdown (TSD)
If the junction temperature of the device reaches the thermal shutdown limit of +160°C, the AP62250 shuts down both its high-side and low-side
power MOSFETs. When the junction temperature reduces to the required level (+140°C typical), the device initiates a normal power-up cycle with
soft-start.
8
Power Derating Characteristics
To prevent the regulator from exceeding the maximum recommended operating junction temperature, some thermal analysis is required. The
regulator’s temperature rise is given by:
������������������������������ = ������������ ∙ (������������������)
Eq. 6
Where:
PD is the power dissipated by the regulator
θJA is the thermal resistance from the junction of the die to the ambient temperature
The junction temperature, TJ, is given by:
������������ = ������������ + ������������������������������
Eq. 7
Where:
TA is the ambient temperature of the environment



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