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SI N CE 198 1

Handling Precautions

Compare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible.

Although its characteristic significantly reduces thermal stress, it is more susceptible to damage by

external mechanical force.

As a result, special handling precautions need to be observed during assembly using

silicone encapsulated LED products. Failure to comply might lead to damage and

premature failure of the LED.

1. Handle the component along the side surfaces by using forceps or appropriate

tools.(pic.1)

2. Do not directly touch or handle the silicone lens surface. It may damage the internal

circuitry. (pic.2,pic.3)

3. Do not stack together assembled PCBs, containing exposed LEDs. Impact may scratch

the silicone lens or damage the internal circuitry. (pic.4)

4. The outer diameter of the SMD pickup nozzle should not exceed the size of the LED to

prevent air leaks. The inner diameter of the nozzle should be as large as possible. (pic.5)

5. A pliable material is suggested for the nozzle tip to avoid scratching or damaging the

LED surface during pickup. (pic.5)

6. The dimensions of the component must be accurately programmed in the pick-and-place

machine to insure precise pickup and avoid damage during production. (pic.5)

Pic.1

Pic.2

Pic.3

Pic.4

Pic.5