Rev. C 11/18

6

CAP200DG

www.power.com

PI-5615-020515

D08A

SO-8 (D Package)

3.90 (0.154) BSC

Notes:

1. JEDEC reference: MS-012.

2. Package outline exclusive of mold flash and metal burr.

3. Package outline inclusive of plating thickness.

4. Datums A and B to be determined at datum plane H.

5. Controlling dimensions are in millimeters. Inch dimensions

are shown in parenthesis. Angles in degrees.

0.20 (0.008) C

2X

1

4

5

8

2

6.00 (0.236) BSC

D

4

A

4.90 (0.193) BSC

2

0.10 (0.004) C

2X

D

0.10 (0.004) C

2X

A-B

1.27 (0.050) BSC

7X 0.31 - 0.51 (0.012 - 0.020)

0.25 (0.010) M C A-B D

0.25 (0.010)

0.10 (0.004)

(0.049 - 0.065)

1.25 - 1.65

1.75 (0.069)

1.35 (0.053)

0.10 (0.004) C

7X

C

H

o

1.27 (0.050)

0.40 (0.016)

GAUGE

PLANE

0 - 8

1.04 (0.041) REF

0.25 (0.010)

BSC

SEATING

PLANE

0.25 (0.010)

0.17 (0.007)

DETAIL A

DETAIL A

C

SEATING PLANE

Pin 1 ID

B

4

+

+

+

5.45 (0.215)

1.27 (0.050)

0.60 (0.024)

1.45 (0.057)

Reference

Solder Pad

Dimensions

+

4.00 (0.157)