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LCS7260C Datasheet(PDF) 13 Page - Power Integrations, Inc.

Part # LCS7260C
Description  Off-Line LLC Switcher ICs with Integrated 600 V FREDFETs Synchronous Rectification and FluxLink Feedback
PDF  35 Pages
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Manufacturer  POWERINT [Power Integrations, Inc.]
Direct Link  http://www.powerint.com
Logo POWERINT - Power Integrations, Inc.

LCS7260C Datasheet(HTML) 13 Page - Power Integrations, Inc.

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Rev. D 11/22
13
HiperLCS-2
www.power.com
Isolation
Barrier
Device
Pin
Most
Sensitive
Returned to
Pin
Recommended
Value
Notes
Secondary Control
Secondary LSR2000
D1
**
GSA
499 ohm
Switch signal hence pay attention to layout/coupling.
Secondary LSR2000
D2
**
GSA
499 ohm
Switch signal hence pay attention to layout/coupling.
Secondary LSR2000
G1
GSA
4.7 ohm
High current gate-drive. Wider PC-board trace to
limit inductance.
Secondary LSR2000
G2
GSA
4.7 ohm
High current gate-drive. Wider PC-board trace to
limit inductance.
Secondary LSR2000 BPS
GSA
1 mF / 35 V SMD right
at pin. Usually also
47 mF further from pin
Secondary LSR2000 5VS
GSB
10 mF / 10 V SMD
right at pin
Note: this pin also has high internal current spikes,
hence larger capacitor right at the pin.
Secondary LSR2000
IS
**
GSB
RIS resistor + 470 pF
/ 200 V capacitor
Note: the RIS resistor is typically split into two series
resistors to share the voltage rating. Series resistors
are placed as close as possible to the IS pin to limit
external noise coupling.
Secondary LSR2000 CMP
GSB
Initial values (150k +
2.2 nF) // 100 pF. All
components at pin
Compensation components may require modification
to optimize phase-gain response.
Secondary LSR2000
FB
**
GSB
10 k lower resistor
value, at pin
The resistor divider 10 kW low-side resistor is used
to give a good balance between no-load consump-
tion and noise rejection. Lower values will give more
noise immunity but will also increase no-load
consumption.
Secondary LSR2000
PS
GSB
RPS at pin
See data table for selection values.
Table 7.
Data Sheet Body Table.
Basic Layout Guidelines
The HiperLCS-2 is a high-frequency power device and requires careful
attention to circuit board layout in order to achieve maximum
performance. The bypass capacitors need to be positioned and laid
out carefully to minimize trace lengths to the pins they serve.
Surface mount (SMD) components are recommended for minimum
component and PC-board stray inductance.
The HiperLCS-2 has several sensitive pins, used for sensing analog
signals. Good device performance can be achieved by paying special
attention to the layout at and around these pins.
On the primary-side control, both the FL pin and L pin have may be
sensitive to layout.
The FL pin output is essentially a digital output, so for this pin the
issue is to ensure that the GP, FL and 5VL are all directly connected
between the primary and isolation devices. If the grounding is not
done correctly this can lead to potential noise pickup.
For the L pin this is a sensitive analog input pin. The L pin senses
input voltage via a resistor (typically 4 MW). The resistor is typically
made of a series of SMD resistors. Splitting the resistance into
several devices will minimize the voltage stress on each resistor.
There are two different examples of how to connect the L pin to VIN.
The first (incorrect) would be to place all the resistors close to VIN
and then run a long PC-board trace to the L pin. This is incorrect
since the node from resistor to L pin is high-impedance and a long
PC-board trace would allow noise pickup injected into the L pin. The
second (correct) method would be to place ALL the resistors close to
the L pin and run a long PC-board trace to VIN. This method is
correct since the node from resistor to VIN is very low-impedance
and thus very unlikely to pick-up noise. On the secondary-side
control, the FB, CMP, IS and D1/D2 pins may be sensitive to layout.
The FB pin is a high impedance voltage input pin. It is connected to
V
OUT via a resistor divider (RUPPER, RLOWER). VOUT is a low-impedence
node, so this may be the long PC-board connection. The node from
R
UPPER to RLOWER, is high impedance and should be placed as close and
tightly coupled as possible to the FB and GSB pins. The general
recommendation for R
LOWER is 10 kW, which is a good compromise
between no-load consumption and noise immunity. Further reducing
R
LOWER would increase noise immunity but increase no-load consumption.
Note that any noise injected into the FB pin could be observed as
duty-cycle and/or frequency variation.
The CMP pin is a high impedance current output and voltage-input
pin. The compensation network of one-resistor and two capacitors’ is
should be place as closely and tightly coupled as possible to the CMP



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