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ATA663201 Datasheet(PDF) 13 Page - Microchip Technology |
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ATA663201 Datasheet(HTML) 13 Page - Microchip Technology |
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13 / 36 page ![]() 2018-2021 Microchip Technology Inc. DS20006075D-page 13 ATA663201/03/31/54 1.6.4 INPUT/OUTPUT (TXD) (SBC ONLY) In Normal mode, the TXD pin is the microcontroller interface for controlling the state of the LIN output. TXD must be pulled to ground in order to drive the LIN bus low. If TXD is high or unconnected (internal pull-up resistor), the LIN output transistor is turned off and the bus is in the recessive state. If the TXD pin stays at GND level while switching into Normal mode, it must be pulled to high level longer than 10 µs before the LIN driver can be activated. This feature prevents the bus line from being accidentally driven to dominant state after the Normal mode has been activated (also in case of a short circuit at TXD to GND). During Fail-Safe mode, this pin is used as output and signals the fail- safe source. The TXD input has an internal pull-up resistor. An internal timer prevents the bus line from being driven permanently in the dominant state. If TXD is forced to low longer than tdom > 20 ms, the LIN bus driver is switched to the recessive state. Nevertheless, when switching to Sleep mode, the actual level at the TXD pin is relevant. To reactivate the LIN bus driver, switch TXD to high (> 10 µs). 1.6.5 GROUND PIN (GND) The IC does not affect the LIN bus in the event of GND disconnection. It is able to handle a ground shift of up to 11.5% of VVS. 1.6.6 BUS PIN (LIN) (SBC ONLY) A low-side driver with internal current limitation and thermal shutdown as well as an internal pull-up resistor according to LIN specification 2.x is implemented. The voltage range is from -27V to +40V. This pin exhibits no reverse current from the LIN bus to VS, even in the event of a GND shift or VBat disconnection. The LIN receiver thresholds comply with the LIN protocol specification. The fall time (from recessive to dominant) and the rise time (from dominant to recessive) are slope-controlled. During a short circuit at LIN to VBat, the output limits the output current to IBUS_LIM. Due to the power dissipation, the chip temperature exceeds TLINoff and the LIN output is switched off. The chip cools down and after a hysteresis of Thys, switches the output on again. RXD stays on high because LIN is high. The VCC regulator works independently during LIN overtemperature switch-off. During a short circuit from LIN to GND, the IC can be switched into Sleep or Silent mode and even in this case the current consumption is lower than 100 µA in Sleep mode and lower than 120 µA in Silent mode. If the short-circuit disappears, the IC starts with a remote wake-up. The reverse current is <2 µA at pin LIN during loss of VBat. This is optimal behavior for bus systems where some LIN nodes are supplied from battery or ignition. 1.6.7 SUPPLY PIN (VS) LIN operating voltage is VVS = 5V to 28V. Undervoltage detection is implemented to disable transmission if VVS falls below typical 4.5V, thereby avoiding false bus messages. After switching on VVS, the IC starts in Fail- Safe mode and the voltage regulator is switched on. The supply current in Sleep mode is typically 9 µA and 47 µA in Silent mode. 1.6.8 VOLTAGE REGULATOR OUTPUT PIN (VCC) The internal 3.3V/5V voltage regulator is capable of driving loads up to 85 mA, supplying the microcontroller and other ICs on the PCB and is protected against overload by means of current limitation and overtemperature shutdown. Furthermore, the output voltage is monitored and causes a reset signal at the NRES output pin if it drops below a defined threshold VVCC_th_uv_down. |
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