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TLP3555AF Datasheet(PDF) 1 Page - Toshiba Semiconductor |
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TLP3555AF Datasheet(HTML) 1 Page - Toshiba Semiconductor |
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1 / 16 page ![]() TLP3555A,TLP3555AF 1 Photocouplers Photorelay TLP3555A,TLP3555AF TLP3555A,TLP3555AF TLP3555A,TLP3555AF TLP3555A,TLP3555AF Start of commercial production 2018-05 1. 1. 1. 1. Applications Applications Applications Applications • Heating, ventilation and air conditioning (HVAC) • Mechanical relay replacements • ATE (Automatic Test Equipment) • Factory Automation (FA) • Security Systems 2. 2. 2. 2. General General General General The TLP3555A and TLP3555AF photorelay consist of a photo MOSFET optically coupled to an infrared LED. It is housed in a 4-pin DIP package. The low ON-state resistance and the high permissible ON-state current of the TLP3555A and TLP3555AF make it suitable for power line control applications. 3. 3. 3. 3. Features Features Features Features (1) Normally opened (1-Form-A) (2) OFF-state output terminal voltage: 60 V (min) (3) Trigger LED current: 3 mA (max) (4) ON-state current: 3 A (max) (5) ON-state resistance: 100 mΩ (max) (6) Isolation voltage: 2500 Vrms (min) (7) Safety standards UL-recognized: UL 1577, File No.E67349 cUL-recognized: CSA Component Acceptance Service No.5A File No.E67349 UL-recognized: UL 508, File No.E499232 (Note 1) (Note 1) (Note 1) (Note 1) VDE-approved: EN 60747-5-5 (Note 2) (Note 2) (Note 2) (Note 2) Note 1: Please refer Absolute Maximum Ratings (UL-recognized UL 508) for UL 508 products. Note 2: When a VDE approved type is needed, please designate the Option (D4) Option (D4) Option (D4) Option (D4). 4. 4. 4. 4. Mechanical Parameters Mechanical Parameters Mechanical Parameters Mechanical Parameters Characteristics Creepage distances Clearance distances Internal isolation thickness 7.62-mm pitch TLP3555A 7.0 (min) 7.0 (min) 0.4 (min) 10.16-mm pitch TLP3555AF 8.0 (min) 8.0 (min) 0.4 (min) Unit mm 2020-03-25 Rev.3.0 ©2017-2020 Toshiba Electronic Devices & Storage Corporation |
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