Figure 14. 36-Pin Side-Brazed DIP, Dual Cavity

Notes:

1. Package material: opaque ceramic.

2. All package finishes are per MIL-PRF-38535.

3. It is recommended that package ceramic be mounted on a heat removal

rail in the printed circuit board. A thermally conductive material should

be used.

LEAD 1

INDICATOR

0.005 MIN.

.610 MAX.

.570 MIN.

.015 MAX.

.008 MIN.

.620 MAX.

.590 MIN.

(AT SEATING PLANE)

1.89 MAX.

0.001 MIN.

.023 MAX.

.014 MIN.

0.155

MAX.

0.150

MIN.

0.100