M24C16-W datasheet(24/40 Pages) STMICROELECTRONICS

24 / 40 page

Package information

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages,

depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product

status are available at www.st.com. ECOPACK is an ST trademark.

For die information concerning the M24C16 delivered in unsawn wafer, please contact your nearest ST Sales

Office.

9.1

UFDFPN5 (DFN5) package information

UFDFPN5 is a 5-lead, 1.7 × 1.4 mm, 0.55 mm thickness, ultra thin fine pitch dual flat package.

Figure 13. UFDFPN5 - Outline

Top view

(marking side)

Side view

Bottom view

(pads side)

Pin 1

Maximum package warpage is 0.05 mm.

Exposed copper is not systematic and can appear partially or totally according to the cross section.

Drawing is not to scale.

On the bottom side, pin 1 is identified by the specific pad shape and, on the top side, pin 1 is defined from

the orientation of the marking. When reading the marking, pin 1 is below the upper left package corner.

M24C16-W M24C16-R M24C16-F

Package information

DS9194 - Rev 11

page 24/40

M24C16-W Datasheet(PDF) 24 Page - STMicroelectronics